| 摘要 |
A filled silicone composition comprising a curable silicone composition comprising at least one silicone resin, and a low-melting inorganic glass filler having a glass transition temperature not greater than 700° C. and a softening point not greater than 800° C.; a silicone adhesive comprising a cured product of at least one silicone resin, and a low-melting inorganic glass filler; and a coated substrate and a laminated substrate, each comprising the silicone adhesive. |
