| 摘要 |
According to one embodiment, a three-dimensional nonvolatile semiconductor memory includes a semiconductor substrate, a memory cell array includes memory cells stacked on the semiconductor substrate and first conductive layers connected to the memory cells, a dummy stacked layer structure includes second conductive layers stacked on the semiconductor substrate, and surrounding the memory cell array, and a metal layer provided on the memory cell array and the dummy stacked layer structure. The second conductive layers are fixed on a ground potential. |
