| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board capable of securely sealing the gap between an IC chip and a resin insulating layer of the outermost layer using an underfill material. <P>SOLUTION: A resin insulating layer 25 of the outermost layer which constitutes a multilayer wiring board is constituted with the same resin insulating material as the resin insulating layer of the inner layer as a main body and includes a silica filler 57. In a hole making processing, an opening portion 43 to expose a connection terminal 41 is formed by performing a laser hole processing to the resin insulating layer 25 of the outermost layer. In a desmear processing, smear in the opening portion 43 is removed. In a filler reduction processing, the silica filler 57 is reduced which is exposed on the surface of the resin insulating layer 25 by performing a high-pressure water processing. <P>COPYRIGHT: (C)2012,JPO&INPIT |
