发明名称 ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component capable of suppressing a crack on a ceramic element body caused by stress concentrated at the end portion of an external electrode. <P>SOLUTION: An electronic component 1 includes: an external electrode main body portion having first and second external electrodes 5, 6 covering the side face of a ceramic element body 2; and a folding portion connected to the external electrode main body portion and reaching the upper face and the lower face of the ceramic element body 2. A plurality of reinforcement electrodes 7, 8 are formed in the ceramic element body 2. On the upper face or the lower face of the ceramic element body 2, the end portion of at least one reinforcement electrode out of the plurality of reinforcement electrodes 7, 8 is exposed at the inner side of the ceramic element body 2 than thick film electrode layers 5a, 6a at the folding portion. Plating layers 5b, 6b are formed so as to cover the thick film electrode layers 5a, 6a and the exposed portion of at least one reinforcement electrode. Thus, at the folding portion, the inside end edges of the plating layers 5b, 6b are placed at the inner side than the inside end edges of the thick film electrode layers 5a, 6a. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012044151(A) 申请公布日期 2012.03.01
申请号 JP20110131439 申请日期 2011.06.13
申请人 MURATA MFG CO LTD 发明人 SASAKI TOMOYOSHI
分类号 H01G4/30;H01G4/12 主分类号 H01G4/30
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