发明名称 THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermosetting epoxy resin composition which gives a cured product in which reflexibility, heat resistance, and light resistance are held for long period of time, and which is uniform and has little yellowing. <P>SOLUTION: The thermosetting epoxy resin composition includes (A) the combination of (A-1) a triazine derivative epoxy resin and (A-2) an acid anhydride, or a prepolymer which is obtained by reacting them, (B) an antioxidant consisting of a compound expressed by formula (1) (wherein R is an alkyl group shown by C<SB POS="POST">n</SB>H<SB POS="POST">2n+1</SB>, and n is an integer of 1-10), (C) an internal mold release agent, (D) a reflective improver, (E) an inorganic filler, and (F) a curing catalyst. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012041403(A) 申请公布日期 2012.03.01
申请号 JP20100181886 申请日期 2010.08.16
申请人 SHIN-ETSU CHEMICAL CO LTD 发明人 TAGUCHI YUSUKE;IKEDA TATSUHIKO
分类号 C08L63/00;C08G59/32;C08K3/00;C08K3/22;C08K5/09;C08K5/103;C08K5/13 主分类号 C08L63/00
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