| 摘要 |
<p>This conductive rubber component (10) is capable of surface mounting and soldering on, and has a metal film (2) formed by means of atomic and/or molecular deposition on at least one surface in the direction of compression of a conductive rubber unit (1). The method for mounting the conductive rubber component (10) surface mounts the conductive rubber component (10) onto a wiring layer (8) on a printed circuit board (9), and affixes the conductive rubber component by means of a solder layer (7), incorporating the conductive rubber component in order for there to be electrical conduction between the printed circuit board (9) and an electronic component (11). As a result, provided are: a conductive rubber component that is used as an electric contact compatible with surface mount technology (SMT) of electronic components, does not damage the electrode surface of the electronic component even if the body of these electronic apparatuses warps or bends, has low resistance, superior chemical stability, and can be used with SMT; and a method for mounting the conductive rubber component.</p> |
