发明名称 COPPER ALLOY-STUCK ANTIBACTERIAL PAPER AND METHOD FOR PRODUCING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide copper alloy-stuck antibacterial paper which is obtained by discontinuously depositing a copper alloy composition that is inexpensive, has excellent printability and easy-to-read properties and contains 70-90 mass% Cu and 10-30 mass% one or more elements selected from the group comprising Ag, Al, Cr, Fe, Mg, Ni, Si, Sn, Ti, Zn and Zr, on the surface of a paper sheet and to provide a method for producing the copper alloy-stuck antibacterial paper. <P>SOLUTION: The copper alloy-stuck antibacterial paper is obtained by depositing 30-94 mg/m<SP POS="POST">2</SP>of the copper alloy composition that contains 70-90 mass% Cu and 10-30 mass% one or more elements selected from the group comprising Ag, Al, Cr, Fe, Mg, Ni, Si, Sn, Ti, Zn and Zr, on at least one main surface of the paper sheet by an electron beam heating-type vapor deposition method to form a discontinuous and non-dense film for covering 70-90% of the total area of at least one main surface of the paper sheet. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012040798(A) 申请公布日期 2012.03.01
申请号 JP20100184947 申请日期 2010.08.20
申请人 MITSUBISHI SHINDOH CO LTD 发明人 SAKURAI TAKESHI;AIDA MASAYUKI
分类号 B32B15/12;A01N25/34;A01N59/16;A01N59/20;A01P3/00;B32B3/10;C22C9/00;C22C9/01;C22C9/02;C22C9/04;C22C9/06;C22C9/10;D21H21/36 主分类号 B32B15/12
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