| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor sealing device that can be downsized, and that can perform vacuum sealing with small energy. <P>SOLUTION: In a semiconductor sealing device, a semiconductor element 50 is mounted on a substrate, and the semiconductor element 50 is covered by a sealing member 53. An UV-curing adhesive 51 adhered to a circumference of the sealing member 53 is irradiated with ultraviolet ray to seal the semiconductor element 50. The semiconductor sealing device has: a vacuum chamber 1 that makes a substrate 52 on which the semiconductor element 50 is mounted and the sealing member 53 be in an airtight state, and that is provided with an ultraviolet ray transmission window 11; vacuum means 3 that vacuums the inside of the vacuum chamber; and ultraviolet ray irradiation means 4 that irradiates the UV-curing adhesive 51 adhered to the circumference of the sealing member 53 with ultraviolet beam via the ultraviolet ray transmission window 11 from the outside of the vacuum chamber 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
