Package for an implantable neural stimulation device

摘要

An implantable device, comprising a rigid substrate having an electrically non-conductive portion; a plurality of electrically conductive vias through said electrically non-conductive portion, said vias and electrically non-conductive portion forming said rigid substrate; a flex substrate attached to said rigid substrate, and electrically connected to at least one of said plurality of electrically conductive vias; a flip-chip circuit attached to said flex substrate; a second circuit attached to said flex substrate, including discrete passives, the flex substrate folded to vertically stack said flip-chip circuit, and said second circuit; and a cover bonded to said rigid substrate, said cover and said rigid substrate forming a hermetic package.