| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a forming method of bumps capable of miniaturizing a device to be mounted by allowing lower profile a light-emitting device, and to provide a bump. <P>SOLUTION: In the formation method of bumps for second bond in wire-bonding while being provided on the bonding electrode in a light-emitting element, a ball is pressed against the bonding electrode for bonding by lowering a capillary in which the ball is formed at the tip of a wire, the capillary is raised vertically while pulling the wire, the capillary is shifted sideways in a direction differing from the wiring direction of the wire in wire-bonding, the capillary is lowered, and the bottom surface of the capillary is pressed against a bump surface for forming an inclined surface on the bump surface. <P>COPYRIGHT: (C)2008,JPO&INPIT |
