| 摘要 |
PURPOSE: A tape for processing a wafer is provided to prevent double die in a pickup process by including a base film, an adhesive layer, and a bonding layer. CONSTITUTION: A tape for processing a wafer includes a base film, an adhesive film(12), and a bonding layer(13). The adhesive film is comprised of an adhesive layer(12b) formed on the base film. The bonding layer is laminated on the adhesive film. A strength ratio(D/C) is 0.8 or less. The C is a tearing strength of the rectangular tearing test piece. The D is a tearing strength of the rectangular tearing test piece with a cut part of 1mm from the lead end of a rectangular unit in a central line passing through the leading end of a rectangular unit of a rectangular tearing test piece.
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