Printed wiring board and method of producing a printed wiring board

摘要

There is provided a multilayer printed wiring board (88) comprising an underlayer conductor circuit (57), an interlaminar resin insulating layer (68) formed on the underlayer conductor circuit (57), an upper layer conductor circuit formed on the interlaminar resin insulating layer (68) and a via-hole (86) connecting the underlayer conductor circuit (57) to the upperlayer conductor circuit wherein the underlayer conductor circuit (57) and the upperlayer conductor circuit comprise an electroless plated film (74) and an electrolytic plated film (78) formed on the electroless plated film (74), and the conductor circuit has a roughened surface (65,81).