METHOD FOR MANUFATURING PACKAGE SUBSTRATE

摘要

PURPOSE: A package substrate manufacturing method is provided to effectively discharge flux, bubbles, and etc. remaining on a solder paste, thereby improving junction reliability of a lead pin. CONSTITUTION: A solder paste is arranged on a lead pin junction area of a package substrate(S110). A first reflow process for arranging a solder bump is performed by thermally processing the solder paste(S120). A lead pin is arranged on the solder bump(S130). A second reflow process is performed for welding the lead pin on the package substrate(S140). A first reflow step is performed in a first processing condition with a temperature which is the melting point of the solder paste or less. A second reflow step is performed in a second processing condition with a temperature higher than a temperature in a first temperature condition.