发明名称
摘要 <p>One embodiment of the present invention is a conductive substrate including: a conductive layer, and a transparent conductive layer on at least one surface of a transparent substrate in this order from the transparent substrate side. According to the present invention, it becomes possible to provide a conductive substrate, wherein positioning of the transparent conductive layer and the metal wiring is easy, a method of manufacturing thereof, and a touch panel, even in the conductive substrate where the shape of the transparent conductive layer pattern is inconspicuous.</p>
申请公布号 JP4888608(B2) 申请公布日期 2012.02.29
申请号 JP20110148951 申请日期 2011.07.05
申请人 发明人
分类号 H01B5/14;B32B7/02;G06F3/041;G06F3/044;H01B13/00 主分类号 H01B5/14
代理机构 代理人
主权项
地址