RADIANT HEAT SUBSTRATE AND METHOD FOR MANUFACTURING THE RADIANT HEAT SUBSTRATE, AND LUMINOUS ELEMENT PACKAGE WITH THE RADIANT HEAT SUBSTRATE

摘要

PURPOSE: A radiation substrate and a light emitting device package including the same are provided to improve heat dissipation efficiency by forming a conductive substrate by using metal materials having high thermal conductance. CONSTITUTION: A conductive substrate has a front side in which a light emitting device is mounted and a rear side which is opposite side of the front side. An insulating layer(120) covers the front side of the conductive substrate. A metal oxide layer covers the rear side of the conductive substrate. A metal pattern(132) covers the insulating layer. The metal pattern comprises a heat transfer pad welded with the light emitting device and a circuit wire. The circuit wire is arranged in a domain in which the light emitting device is not mounted and is electrically connected to the light emitting device.