| 摘要 |
PURPOSE: A resin composition for a semiconductor chip tray is provided to have superior physical properties like tensile strength, heat resistance, dimensional stability, conductivity, and light weight characteristic. CONSTITUTION: A resin composition for a semiconductor chip tray comprises 55-80 weight% of a liquid crystal polymer resin, 1-5 weight% of a carbon fiber, and 15-40 weight% of a glass fiber. The liquid crystal polymer resin is selected from liquid polyester, liquid polyesteramide, liquid polyesterether, liquid polyestercarbonate, liquid polyesterimide, liquid polyamide, or mixtures thereof.
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