THE METHOD FOR MANUFACTURING MEASURABLE VIA TEST PATTERNS AND CHARACTERIZATION OF VIA IN MULTI-LAYERED IC PACKAGE,申请号KR20090099769-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	THE METHOD FOR MANUFACTURING MEASURABLE VIA TEST PATTERNS AND CHARACTERIZATION OF VIA IN MULTI-LAYERED IC PACKAGE
摘要
申请公布号	KR101111444(B1)	申请公布日期	2012.02.24
申请号	KR20090099769	申请日期	2009.10.20
申请人		发明人
分类号	H01L21/66	主分类号	H01L21/66
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Wind deflector device

Waste disposal apparatus

PROCESS FOR PRODUCING FLUOROPOLYMER

PROCESS FOR PRODUCING FURFURAL, FORMIC ACID AND ACETIC ACID FROM SPENT PULP-COOKING LIQUOR

Isoquinolinone potassium channel inhibitors

Surface protection of porous ceramic bodies

Semiconductor memory device using magnetoresistive-effect element

Semi-persistent scheduling grants in heterogeneous networks

Wave power generation device and method of controlling the same

LOW MOLECULAR WEIGHT CELLULOSE MIXED ESTERS AND THEIR USE AS LOW VISCOSITY BINDERS AND MODIFIERS IN COATING COMPOSITIONS

Method of allocating resources in wireless communication system

QUANTUM ENERGY OCCURRENCE MATERIAL USING ENERGY SAVER

SEED MULCHING DEVICE

A DEVICE AND METHOD FOR LIFTING ABDOMINAL WALL DURING MEDICAL PROCEDURE

INSULATING RING AND LITHIUM ION BATTERY HAVING THE SAME

DIGITAL CONTENTS DISTRIBUTION METHOD AND SYSTEM

DEVICE FOR COUPLING WINDOW AND DOOR

INTEGRATED ORDER AND DELIVERY MANAGEMENT SYSTEM FOR CUSTOMER

INTELLIGENT PARKING MANAGEMENT METHOD AND SYSTEM BASED ON CAMERA

WARMER FOR CUP HAVING LIGHTING FUNCTION