| 摘要 |
<P>PROBLEM TO BE SOLVED: To optimize alignment mark detection conditions. <P>SOLUTION: An alignment mark system is used to detect an alignment mark (EGA mark or search mark) formed on a wafer under a plurality of illumination conditions or a plurality of imaging conditions. Then a determination amount related to a waveform symmetry of the detection signal is calculated by performing analysis processing of the acquired detection signal using a predetermined signal processing algorithm (steps 302 to 310). Next, WIS for the detection results of a plurality of the marks is evaluated based on the determination amount (step 312) and detection conditions other than the plurality of the illumination conditions or the plurality of the imaging conditions are optimized based on the analysis result (step 314). This enables the alignment mark detection conditions to be optimized so as to minimize WIS for the detection results. <P>COPYRIGHT: (C)2012,JPO&INPIT |
