| 摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture, without requiring polishing, a planarized resin-coated printed circuit board having both surfaces planarized at an extremely high level, and having constant thickness over all regions of the printed circuit board, and having excellent component packaging stability and impedance characteristics; and provide a multilayer printed circuit board useful as an internal layer and a printed circuit board useful as an external layer, which are the printed circuit boards having both surfaces planarized at an extremely high level. <P>SOLUTION: A light-heat curing resin composition 105 is coated onto one surface of a printed circuit board 101 with a through hole 103, and onto the through hole 103, and the following steps (1) and (2) are carried out sequentially. Thereafter, the light-heat curing resin composition 105 is coated onto the other surface of the printed circuit board 101, and the following steps (1)-(3) are carried out sequentially: the step (1) of planarizing the coated resin surface by a pressure roll 107; the step (2) of subjecting the coated resin to light curing 109; and the step (3) of subjecting light curing resin to heat curing 110. <P>COPYRIGHT: (C)2012,JPO&INPIT |
