| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package and a fabrication method thereof to relax stress and prevent cracking from occurring. <P>SOLUTION: A package comprises: a conductive base plate; a semiconductor device disposed on the conductive base plate; a metal wall including a semiconductor device, disposed on the conductive base plate; a through hole provided in an input/output portion of the metal wall; a feedthrough lower layer portion fitted into the through hole and disposed on the conductive base plate; and a feedthrough upper layer portion fitted into the through hole and disposed on the feedthrough lower layer portion. In the package and a fabrication method thereof, the feedthrough upper layer portion is formed so that the thickness thereof is thicker than the thickness of the metal wall. <P>COPYRIGHT: (C)2012,JPO&INPIT |
