| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing packages, a package, a piezoelectric transducer, an oscillator, an electronic apparatus and a radio clock that can maintain air-tightness within a cavity and improve mechanical strength of a penetration electrode by filling the cavity with glass frits without leaving a space. <P>SOLUTION: The penetration electrode forming process includes: a penetration hole forming process for forming a penetration hole on a first surface 40a of a wafer 40 for a base substrate; a metal pin arrangement process for inserting a metal pin 37 in the penetration hole; a filling process for filling the space between the penetration hole and the metal pin 37 with a glass frit 38; a calcination process for calcinating the glass frit 38 filled in the penetration hole for hardening; and a grinding process for grinding at least a second surface 40b of the wafer 40 for a base substrate to expose the metal pin 37 to the second surface 40b, apart from a lipophilization treatment process for performing lipophilization treatment on at least either one of the wafer 40 for a base substrate and the metal pin 37 before the filling process. <P>COPYRIGHT: (C)2012,JPO&INPIT |
