发明名称 DIE AND MOLDING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To release bubbles in a molding resin to the outside. <P>SOLUTION: On an upper surface 1A of a die, a recessed part 31 is formed to protrude from a vertical left-end groove 21 toward a left edge 1b, and a recessed part 32 is formed to protrude from a vertical right-end groove 22 toward a right edge 1d on extensions of a groove 11 directed orthogonally to a direction of a lattice. The recessed parts 31, 32 function as bubble relief parts when molding using the die. After the resin is applied to the die and a glass substrate is pressed on it, the die integrated with the glass substrate is put into a vacuum box and the die is drawn out at an appropriate degree of vacuum. At that time, the bubbles in the resin are guided to the bubble relief parts in the die and no accumulation of bubbles is generated in a molding. In this state, UV irradiation is performed to cure the resin. The invention is applicable to the die of a component of a display device displaying a 3D images. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012035571(A) 申请公布日期 2012.02.23
申请号 JP20100179616 申请日期 2010.08.10
申请人 SONY CORP 发明人 WATANABE YASUHIRO;NAGAI HIROYUKI
分类号 B29C33/10;B29C39/26 主分类号 B29C33/10
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