METHOD AND APPARATUS FOR MANUFACTURING EPOXY RESIN MOLDING MATERIAL AND RESIN SEALING TYPE SEMICONDUCTOR APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin molding material capable of manufacturing a semiconductor package with high reliability.

SOLUTION: There are provided an apparatus 1 for manufacturing the epoxy resin molding material includes: a mixing machine 2 for uniformly mixing an epoxy resin composition in which an epoxy resin being solid at an ordinary temperature, a phenol resin being solid at an ordinary temperature, a curing accelerator and an inorganic filling material are essential components to prepare composite material powder; a multi-stage heating roll machine 3 for making a sheet-like kneaded sheet by melting and kneading the composite material powder and having a bi-axial heating roll machine with at least two stages; a cooling machine 4 for cooling and solidifying the kneaded sheet to prepare a solid sheet; and a grinding machine 5 for grinding the solid sheet to prepare a powdery epoxy resin molding material; and a method for manufacturing the epoxy resin molding material using this.

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