| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device and a semiconductor manufacturing device capable of preventing wire flow and uniforming external dimensions of the semiconductor device. <P>SOLUTION: A method of manufacturing a semiconductor device includes, when a semiconductor element is mounted, an electrode of the semiconductor element is connected to a wiring pattern of a substrate using a bonding wire, and a pre-sealing substrate where an external terminal is connected to a substrate electrode provided on the back of the substrate is resin-sealed: a first resin sealing process where the pre-sealing substrate is resin-sealed to make it as an in-sealing substrate using a sealing device by the compression mold sealing method; and a second resin sealing process where the in-sealing substrate is resin-sealed using the same sealing device as the one noted above by the transfer sealing method. <P>COPYRIGHT: (C)2012,JPO&INPIT |
