发明名称 CHEMICAL MECHANICAL POLISHING PAD, METHOD FOR MANUFACTURING THE SAME, AND CHEMICAL MECHANICAL POLISHING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad having excellent storage stability, a method for manufacturing the same, and a chemical mechanical polishing method using the chemical mechanical polishing pad. <P>SOLUTION: The chemical mechanical polishing pad according to the present invention is a chemical mechanical polishing pad comprising a polishing layer, whose surface subjected to polishing has a silicon atom concentration or fluorine atom concentration of 0.5 to 10 atom% calculated by elemental analysis using x-ray photoelectron spectroscopy (XPS). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012039093(A) 申请公布日期 2012.02.23
申请号 JP20110145241 申请日期 2011.06.30
申请人 JSR CORP 发明人 KUBO KOTARO;OKAMOTO TAKAHIRO;HOSAKA YUKIO
分类号 H01L21/304;B24B37/20;B24B37/26 主分类号 H01L21/304
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