| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce stresses applied from mold resin to a circuit section provided in a squeezed-out portion on other side of a circuit board in a mold package where a circuit board having a circuit section on either side and mounted on island is encapsulated with mold resin. <P>SOLUTION: A circuit board 10 having circuit sections 13, 14 formed on both sides 11, 12 has the other side 12 connected to an island 20 via adhesive 30, which are all encapsulated with mold resin. The plane size of the adhesive 30 is smaller than the other side 12 of the circuit board 10, and in a squeezed-out portion 12a protruding from the outline of the adhesive 30 on the other side 12 of the circuit board 10, a low adhesion layer 70 whose adhesive strength against the mold resin 40 is lower than for the circuit sections 13, 14 of the circuit board 10 is formed so as to cover the circuit section 14 provided in the squeezed-out portion 12a. <P>COPYRIGHT: (C)2012,JPO&INPIT |
