| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive for connecting a circuit member capable of manufacturing a semiconductor device excellent in solder connectivity, good in preservation stability, and excellent in connection reliability, and to provide an adhesive sheet for connecting the circuit member using the same, the semiconductor device, and a method of manufacturing the semiconductor device. <P>SOLUTION: The adhesive for connecting the circuit member is interposed between a first circuit member in which a plurality of bumps are formed and a second circuit member in which a circuit electrode to be solder-joined to the bump is formed, for bonding both circuit members together by heating and pressurizing. A fluidity is acquired by a method of measuring a scale factor of the area after heating and pressurizing to the area before heating and pressurizing. The fluidity is 1.8-3.0 times under a first heating/pressurizing condition where both circuit members are heat/pressure-bonded at a temperature that does not melt a solder, and is 1.1-3.0 times under a second heating/pressurizing condition where, after heating treatment under the heating condition, both circuit members are heated and pressurized at a temperature that is higher than the heating condition and melts the solder, while being no more than the fluidity under the first heating/pressurizing condition. <P>COPYRIGHT: (C)2012,JPO&INPIT |
