Molded parts used for photographic sensitive materials and resin compositions used to make thereof

摘要

PCT No. PCT/US95/09798 Sec. 371 Date Jan. 30, 1997 Sec. 102(e) Date Jan. 30, 1997 PCT Filed Aug. 1, 1995 PCT Pub. No. WO96/04591 PCT Pub. Date Feb. 15, 1996A novel resin composition for use in applications requiring low formaldehyde concentration levels. The novel composition comprising a stabilized polyacetal polymer with capped end groups is characterized by the concentration of formaldehyde generated from a formed object of the said composition in a closed environment being less than 20 ppm.