Semiconductor Device Packaging Method and Semiconductor Device Package

摘要

Disclosed is a method of manufacturing a discrete semiconductor device package (100), the method comprising providing a discrete semiconductor device wafer (10) having a first surface and a second surface opposite to the first surface, said second surface carrying at least one bond pad for each discrete semiconductor device; applying a copper contact (20, 62) to the first surface; applying under bump metallization portion (32) to each of said bond pads; forming a copper layer portion (34, 62) on each of said under bump metallization portions; and dividing the wafer in a plurality of discrete semiconductor device packages (100). A thus obtained discrete semiconductor device package (100) and a PCB carrying such a package are also disclosed.