发明名称 High temperature anneal for aluminum surface protection
摘要 The present disclosure also provides another embodiment of a method for making metal gate stacks. The method includes forming a first dummy gate and a second dummy gate on a substrate; removing a polysilicon layer from the first dummy gate, resulting in a first gate trench; forming a first metal layer and a first aluminum layer in the first gate trench; applying a chemical mechanical polishing (CMP) process to the substrate; performing an annealing process to the first aluminum layer using a nitrogen and oxygen containing gas, forming an interfacial layer of aluminum, nitrogen and oxygen on the first aluminum layer; thereafter removing the polysilicon layer from the second dummy gate, resulting in a second gate trench; and forming a second metal layer and a second aluminum layer on the second metal layer in the second gate trench.
申请公布号 US8119473(B2) 申请公布日期 2012.02.21
申请号 US20090651017 申请日期 2009.12.31
申请人 HUANG KUO BIN;LI SSU-YI;CHEN RYAN CHIA-JEN;YANG CHI-MING;CHERN CHYI SHYUAN;LIN CHIN-HSIANG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 HUANG KUO BIN;LI SSU-YI;CHEN RYAN CHIA-JEN;YANG CHI-MING;CHERN CHYI SHYUAN;LIN CHIN-HSIANG
分类号 H01L21/8232 主分类号 H01L21/8232
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