| 摘要 |
A semiconductor cooling apparatus having a tank forming body and semiconductor power device mounting substrates is disclosed. The tank forming body includes a first outer plate, a second outer plate, a middle plate, a first inner fin, and a second inner fin. The middle plate is brazed to the outer periphery of the first outer plate and the outer periphery of the second outer plate. The first inner fin is brazed to the first outer plate. A first cooling medium passage is defined between the first outer plate and the first inner fin. A second cooling medium passage is defined between the first inner fin and the middle plate. The second inner fin is brazed to the second outer plate. A third cooling medium passage is defined between the second inner fin and the middle plate. A fourth cooling medium passage is defined between the second outer plate and the second inner fin. The middle plate has a plurality of through holes through which a second cooling medium passage and a third cooling medium passage communicate with each other. Each one of the mounting substrates includes a first surface on which a semiconductor power device is mounted and a second surface brazed to one of the first outer plate and the second outer plate.
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