| 摘要 |
PURPOSE: An apparatus for receiving a wafer, a carrier and an apparatus for polishing a wafer are provided to actively control a thickness of a carrier by easily attaching or detaching a first carrier, a second carrier, and a third carrier. CONSTITUTION: A first carrier(310) includes a first accommodation groove for accepting a wafer. A second carrier(320) is arranged on the first carrier. The second carrier includes a second accommodation groove corresponding to the first accommodation groove. A third carrier(330) is arranged on the second carrier. The third carrier includes a third accommodation groove corresponding to the second accommodation groove.
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