发明名称 |
DEVICE FOR ALIGNING AND PRE-ATTACHING A WAFER |
摘要 |
A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate. |
申请公布号 |
KR20120014557(A) |
申请公布日期 |
2012.02.17 |
申请号 |
KR20117025193 |
申请日期 |
2010.03.31 |
申请人 |
EV GROUP GMBH |
发明人 |
BURGGRAF JURGEN;LINDNER PAUL;PARGFRIEDER STEFAN;BURGSTALLER DANIEL |
分类号 |
H01L21/68;H01L21/683 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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