| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology which emphasizes the change in an absorption current obtained from failure spots included in a wiring section to be inspected in relation to the other wiring sections. <P>SOLUTION: A sample inspection device for outputting absorption current images 13 and 15 by interlocking an absorption current output from two probes 4 into scanning an electron beam 1 at the time of scanning an electron beam adopts the following configuration. When the electron beam is irradiated to a failure spot of wiring sections on the side of a sample 2 electrically connected by the two probes 4, the change in the resistance value is bigger than when the electron beam is irradiated on normal wiring sections. The change in the resistance value is detected as a change of the ratio of the wiring sections to be specified by the two probes 4 and the known resistance value. By this method, the absorption current image 15 corresponding to the failure spot can be easily identified in relation to the absorption current image 13 of the other wiring sections. <P>COPYRIGHT: (C)2012,JPO&INPIT |
