| 摘要 |
PURPOSE: A fan out type semiconductor package is provided to reduce manufacturing costs by including an interposer with a pocket made of molding compound resin. CONSTITUTION: A plurality of pockets(12) whose upper sides are open is formed on a mold interposer(10). A semiconductor chip(14) is attached to a pocket of the mold interposer. An insulator(16) is attached to the upper sides of the mold interposer and the semiconductor chip. A rewiring layer(20) is formed in the insulator. An input and output terminal(18) is fused on the rewiring layer exposed through the insulator. |
