发明名称 RETICLE COOLING IN LITHOGRAPHY DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a device and a method of reducing temperature variation over a reticle so that variation in expansion of the reticle is reduced. <P>SOLUTION: One method of achieving reduced temperature variation is to fill the internal space with pressurized backfill gas by using a distribution trench and wall (e.g. a flow restriction dam) rather than providing uniform backfill gas pressure over the entire reticle. In a different method, outer periphery of the internal space may be selected to reduce variation in expansion over the reticle based on the functional relation between expansion and temperature for a reticle material. In an arbitrary or alternative method, reduced variation in expansion over the reticle can be obtained by filling the cavity in a chuck cooled by fluid selectively with backfill gas. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012033930(A) 申请公布日期 2012.02.16
申请号 JP20110163037 申请日期 2011.07.26
申请人 ASML HOLDING NV 发明人 SAMIA A NAYEF
分类号 H01L21/027;H01L21/683 主分类号 H01L21/027
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