发明名称 METHOD FOR MANUFACTURING CMOS IMAGING DEVICE ARRAY
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a CMOS imaging device having excellent quantum efficiency and a small cross talk between pixels. <P>SOLUTION: The method for manufacturing a photodetector array or pixel array for a CMOS imaging device includes the steps of: forming a plurality of trenches with a high aspect ratio on the front side of a substrate; and forming a plurality of photodiodes on the front side of a substrate and surrounding each of the plurality of photodiodes by trenches with a high aspect ratio in a face parallel to the front of a substrate. In order to clean the trenches, an oxide layer is formed in the inner wall of the plurality of trenches, and the oxide layer is removed from the inner wall of the plurality of trenches. A trench is filled with a high dope member and a substrate is made thin from the back side. This cleaning restricts the diffusion which passes a side wall, generates unnecessary charge carrier recombination in the trench side wall, and removes a defect, residue and impurities which bring about the cross talk between pixels from the trench side wall. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012033928(A) 申请公布日期 2012.02.16
申请号 JP20110160732 申请日期 2011.07.22
申请人 IMEC 发明人 COON DE MUNK;KIKI MINOGLOU;YURI DE VOS
分类号 H01L27/146;H04N5/359;H04N5/374 主分类号 H01L27/146
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