| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element mounting substrate which uniformizes emission intensity distribution of an LED based on a design of the mounting substrate on which the LED is mounted to inhibit deterioration of characteristics (output, Vf, WPE and the like) due to heat generation of the LED. <P>SOLUTION: The semiconductor light-emitting element mounting substrate comprises a support substrate, external connection terminals for electrically connecting with an external power source, first conductivity type side land electrodes and second conductivity type side land electrodes respectively to be bonded to first conductivity type side electrodes and second conductivity type side electrodes of the semiconductor light-emitting element to be mounted on the support substrate. On the semiconductor light-emitting element mounting substrate, a plurality of first conductivity type side land electrodes are provided and additional resistance is inserted into at least one current path among current paths from the first conductivity type side electrode respectively to be connected with the plurality of first conductivity type side land electrodes to the external power source. <P>COPYRIGHT: (C)2012,JPO&INPIT |
