| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a CVD film deposition apparatus, which restrains worsening of haze ratio distribution of a film when a film deposition treatment to a substrate is continued. <P>SOLUTION: The CVD film deposition apparatus includes: an injector 35, having nozzles 39 supplying a supply gas containing a raw gas for a film to be deposited to a substrate; exhaust flow passages 37, which are formed between a pair of faces 34 opposing across the injector 35 and through each of which the supplied supply gas is exhausted from between the substrate and the injector 35; and an exhaust inlet part 34a, which is formed in the vicinity of the substrate of each face of the pair of faces 34. The distance between the exhaust inlet part 34a and the injector 35 at the central part in the width direction of each of the exhaust flow passages 37 is larger than the distance between the exhaust inlet part 34a and the injector 35 at the both ends in the width direction. <P>COPYRIGHT: (C)2012,JPO&INPIT |
