FLIP CHIP SUBSTRATE PACKAGE ASSEMBLY AND PROCESS FOR MAKING SAME

摘要

PURPOSE: A flip chip substrate package assembly process and a manufacturing process thereof are provided to include an under-fill material between a substrate and an integrated circuit after performing a thermal reflow process, thereby preventing thermal stress damage with respect to apparatuses. CONSTITUTION: A substrate(11) is provided. The substrate is formed using a core(19) which includes a penetration hole(25). The penetration hole is charged with conductive plugs or filler(21). A bump pad is arranged on the upper part of a dielectric material(16). A solder mask(15) is filled with a free solder material(27).