| 摘要 |
<P>PROBLEM TO BE SOLVED: To remove variance of an offset component appearing in measurement data owing to vibration caused when a wafer is transferred. <P>SOLUTION: Parallel section shape data Zf_X0 is found by irradiating a light cutting line in a Y direction. Orthogonal section shape data Zg_Y0, Zg_Y1, ..., Zg_Yn are found by irradiating the light cutting line in an X direction. Offset values o(Y0), o(Y1), ..., o(Yn) are found so that height data at a position of intersection of the parallel section shape data Zf_X0 and the orthogonal section shape data is equal. Offset values o(Y0), o(Y1), ..., o(Yn) are added to the orthogonal section shape data Zg_Y0, Zg_Y1, ..., Zg_Yn to find corrected orthogonal section shape data Zg_Y0', Zg_Y1', ..., Zg_Yn'. <P>COPYRIGHT: (C)2012,JPO&INPIT |
