LOW MOISTURE PERMEABILITY RESIN COMPOSITION AND HARDENED MATERIAL THEREOF

摘要

Provided is a low moisture permeability resin composition for an electronic device which can be used as a sealant or a sealing compound for an organic light-emitting diode, an electronic paper or a solar battery, and can form a hardened material excellent in low moisture permeability. The present invention provides a low moisture permeability resin composition for an electronic device requiring low moisture permeability, characterized by containing: a compound (A) having two or more reactive functional groups (a) in one molecule; a compound (B) having one reactive functional group (b) in one molecule, and a molecular weight of 50 to 1000; and a polymerization initiator (C).