| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device effectively dispersing heat generated during the operation of a semiconductor element into a sealing member, improving a heat radiating property of the semiconductor device, and reducing heat resistance. <P>SOLUTION: A semiconductor device comprises a substrate, a semiconductor element disposed on the substrate, a heat radiating member disposed on the semiconductor element, and a sealing member covering an upper part of the substrate, the semiconductor element, and the heat radiating member. The surface area of a surface disposed on the semiconductor element of the heat radiating element is larger than the surface area of a surface on which the heat radiating member of the semiconductor element is disposed. According to the semiconductor device of this invention, the heat radiating member is buried in the inside of the sealing member, thereby effectively dispersing heat generated during the operation of the semiconductor element into the sealing member by the heat radiating member with a smaller area than a conventional heat radiating member, improving the heat radiating property of the semiconductor device, and reducing heat resistance. <P>COPYRIGHT: (C)2012,JPO&INPIT |
