DEFECT INSPECTION METHOD AND DEFECT INSPECTION APPARATUS

摘要

PROBLEM TO BE SOLVED: To solve such a problem that in a method for mounting a contact sensor on a head tip part and detecting a defect by contact with the defect, the defect may be dragged and a wafer surface may be damaged by the defect in the defect detection.

SOLUTION: A method for detecting a defect on the surface of a sample includes: a pre-scanning defect inspection process including a pre-scanning irradiation step for irradiating the surface of the sample with illuminating light, a pre-scanning detection step for detecting scattered light and a pre-scanning defect information collection step for obtaining information of a predetermined defect existing on the surface of the sample based on the scattered light; a near-field defect inspection process including a near-field irradiation step for adjusting a distance between the surface of the sample and a near-field head and irradiating the surface of the sample with light, a near-field detection step for detecting near-field light response and a near-field defect information collection step for obtaining information of the predetermined defect based on the near-field light; and a merging process for merging the information of the predetermined defect and inspecting the defect existing on the surface of the sample.

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