| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a communication module capable of outputting a communication signal stably. <P>SOLUTION: A communication module includes: a module mounting member provided with an integrated circuit element mounting pad and a piezoelectric device mounting pad on one principal surface of the module mounting member; an integrated circuit element mounted on the integrated circuit element mounting pad; an piezoelectric device which is mounted on the piezoelectric device mounting pad, and includes an element mounting member whose connection terminal for the module mounting member is provided on the first principal surface, a piezoelectric device mounted on the piezoelectric device mounting pad and a piezoelectric vibration element mounted on the other principal surface of the element mounting member, and a lid member for hermetically sealing the piezoelectric vibration element; and a resin layer provided so as to cover the piezoelectric device and the integrated circuit element. The thickness of the resin layer from the surface of the lid member to the outer surface of the resin layer is 50 to 250 μm. <P>COPYRIGHT: (C)2012,JPO&INPIT |
