发明名称 THERMOPLASTIC MOULDING COMPOSITIONS WITH IMPROVED ADHESION OF ELECTROPLATED METAL LAYER
摘要 <p>A thermoplastic moulding composition with improved metal plating properties is provided. This thermoplastic moulding composition is produced from a graft copolymer (A) a thermoplastic polymer (B) and a thermoplastic polymer (C) that is not, or only to a limited amount miscible with the thermoplastic polymer (B). The thermoplastic polymer (C) contains from 1.2 to 3 % by weight of at least one monoethylenically unsaturated monomer, like acrylic acid, methacrylic acid, or dicarboxylic acids, such as maleic acid and fumaric acid and their anhydrides, such as maleic anhydride. The vinyl aromatic content of component (C) is at least 5 units lower compared to that of component (B). The graft copolymer is produced from a soft elastomeric particulate graft base with a glass transition temperature below 0°C obtained by emulsion polymerization of a conjugated diene alone or with a small amount of a monoethylenically unsaturated monomer or of at least one C1-8-alkyl acrylate, or of mixtures of these, upon which is grafted a vinyl aromatic monomer and acrylonitrile and optionally another monoethylenically unsaturated monomer.</p>
申请公布号 WO2012019982(A1) 申请公布日期 2012.02.16
申请号 WO2011EP63581 申请日期 2011.08.08
申请人 BASF SE;PEPERS, MICHEL;WENDEL, KLAUS;SUWIER, DAVY ROGER;NIESSNER, NORBERT 发明人 PEPERS, MICHEL;WENDEL, KLAUS;SUWIER, DAVY ROGER;NIESSNER, NORBERT
分类号 C08L51/00;C08L25/12;C08L51/04;C08L55/02;C23C14/00;C23C18/31;C25D5/56 主分类号 C08L51/00
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