| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board capable of forming a capacitor part in the flow of buildup. <P>SOLUTION: In a printed wiring board 10, the upper electrode connection first part 52a of an upper electrode connection 52 penetrates a capacitor 40 in the vertical direction without touching the capacitor 40, and is connected with an upper electrode 42 from the upper electrode connection second part 52b via the upper electrode connection third part 52c provided above the capacitor 40. A lower electrode connection 51 penetrates the capacitor 40 in the vertical direction so that it does not touch the upper electrode 42 but touches a lower electrode 41. Consequently, the upper electrode connection 52 and the lower electrode connection 51 can be formed, in the flow of buildup, even after the entire surface is covered with a high dielectric capacitor sheet having such a structure as a high dielectric layer is sandwiched by two metal foils and becoming the capacitor 40 later. <P>COPYRIGHT: (C)2012,JPO&INPIT |
