| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device, which can simplify a structure for suppressing burrs. <P>SOLUTION: An outer resin portion 5b is arranged so as to surround the outside of an inter resin portion 5a so that the outer resin portion 5b becomes a part of a mold for forming the inner resin portion 5a. The inner resin portion 5a and the outer resin portion 5b are arranged in the same plane at a boundary. In this manufacturing method of a semiconductor device, no space is made in the boundary and occurrence of burrs can be suppressed, and therefore a structure for suppressing burrs can be simplified. <P>COPYRIGHT: (C)2012,JPO&INPIT |
