Semiconductor package having double solder type input and output terminal,申请号KR20090105739-传众专利搜索

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发明名称	Semiconductor package having double solder type input and output terminal
摘要
申请公布号	KR101111424(B1)	申请公布日期	2012.02.16
申请号	KR20090105739	申请日期	2009.11.04
申请人		发明人
分类号	H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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