发明名称 MULTI-MOLDED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a multi-molded wiring board that not only enables the location of each circuit board area in a previous matrix array to be detected absolutely even after a mother board is divided, but also enables the mounting of an electronic part or its mounting to an external electric circuit board to be normally conducted. SOLUTION: This multi-molded wiring board is composed of multiple laminated insulating layers. It is provided with a mother board 1 having a plurality of circuit board areas 2 arranged vertically and horizontally at the center of the principal plane and dummy areas 4 at the periphery, a wiring conductor 3 formed in the wiring board area 2, and a symbol pattern formed in the internal layer at the lower side of each circuit board area 2. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005210028(A) 申请公布日期 2005.08.04
申请号 JP20040017575 申请日期 2004.01.26
申请人 KYOCERA CORP 发明人 MATSUO KAZUHIRO
分类号 H05K1/02;H01L23/13;(IPC1-7):H05K1/02 主分类号 H05K1/02
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